Trades & Technology

For the introductory course in Semiconductor Manufacturing Technology.

This text introduces the terminology, concepts, processes, products, and equipment commonly used in the manufacture of ultra-large-scale integrated (ULSI) semiconductors. The book provides helpful, up-to-date technical information about semiconductor manufacturing and strikes an effective balance between the process and equipment technology found in wafer fabrications.

• Cutting edge of semiconductor technology—Offers future and practicing technicians the latest technical information, including sections on copper interconnect; dual damasceneprocess for metallization; deep UV sub-quarter-micron photolithography (.18 micron and below); low-k dielectric processing; chemical mechanical planarization; and more.

  • Keeps students abreast of the most recent technological tools and techniques, developing their abilities to understand and use the same or similar tools in their own careers. Ex.___

• Process requirement vs. equipment capability—Explains the technical relationship between these two areas, revealing the tradeoffs between the potential performance of equipment and the process parameters required for optimal manufacturing.

  • Allows students to assess the viability of integrating new technology into an existing process—a crucial skill in the professional world. Ex.___

• Comprehensive model of manufacturing process (Ch. 9)—Process chapters with a CMOS process model using diagrams that describes the major semiconductor-manufacturing processes in a comprehensive overview.

  • Forms a basis for students to understand how the different process technologies are related, fostering a deeper understanding of semiconductor manufacturing. Ex.___

• In-depth review of copper metallization and low-k dielectric (Chs. 11-12)—Covers both the traditional approach (i.e., aluminum metallization with silicon dioxide dielectric) and the latest technologies, including the new processing techniques (e.g., dual damascene processing) and new equipment.

  • Briefs students on the latest technological advances that will provide up to a 30% increase in chip performance. Ex.___

• Full chapter on chemical-mechanical planarization (CMP) (Ch. 18)—Discusses equipment and process technology, showing how CMP has facilitated the development of multi-layer metallization.

  • Engages students in one of the most important equipment developments in the 1990's for semiconductor manufacturing. Ex.___

• Equipment and process troubleshooting (Chs. 10-18)—Presents a section devoted to equipment and process troubleshooting within each of the process chapters.

  • Offers students practical advice for troubleshooting advanced wafer manufacturing processes. Ex.___

• Vivid diagrams—Integrates sophisticated illustrations throughout the narrative to complement the technical content.

  • Provides the visual support that today's learners need to fully grasp often abstract concepts and principles. Ex.___

• Instructional support in each chapter—Presents chapter summaries, lists of key terms, and end-of-chapter questions.

  • Guides students through apparatus that reinforces and applies their knowledge to build a solid understanding of essential concepts. Ex.___

• Valuable appendix—Provides an easy-access glossary, safety, and technical information.

  • Serves as an essential reference tool for students that will extend beyond their coursework and into their professional lives. Ex.___

 1. Introduction to the Semiconductor Industry.


 2. Characteristics of Semiconductor Materials.


 3. Device Technologies.


 4. Silicon and Wafer Preparation.


 5. Chemicals in Semiconductor Fabrication.


 6. Contamination Controls in Wafer Fabs.


 7. Metrology and Defect Inspection.


 8. Gas Control in Process Chambers.


 9. IC Fabrication Process Overview.


10. Oxidation.


11. Deposition.


12. Metallization.


13. Photolithography: Vapor Prime to Soft Bake.


14. Photolithography: Alignment and Exposure.


15. Photolithography: Photoresist Development and Advanced Lithography.


16. Etch.


17. Ion Implant.


18. Chemical Mechanical Planarization.


19. Wafer Test.


20. Assembly and Packaging.


Appendices.


Glossary.


Index.

Semiconductor Manufacturing  (Electronics Technology)

This book is written for students in two- and four-year technology programs at community colleges and universities. Chapters are organized around the broad technologies applicable to semiconductor manufacturing.

Chapters 1 to 8 present fundamental technical information relevant to semiconductor manufacturing. Chapter 9 presents a process model overview with a general flowchart that links the major areas in wafer fabrication. Chapters 10 to 19 cover each of the major processes. Each process chapter concludes with a summary of quality measures and troubleshooting issues to provide the student with practical challenges encountered during wafer fabrication. Chapter 20 provides an overview of the back-end process for IC assembly and packaging.

Academic and industry reviewers have applauded this book as the most comprehensive and up-to-date text currently available in the market.

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